Description
Valley Design is an ISO 9001:2015 certified manufacturer of stock and custom wafers, substrates, windows, discs, precision shims, spacers and washers, flat optics, beamsplitters, polarizers, lenses, wedges, waveguides, subassemblies and other components. Since 1975 we have been recognized as an industry leader in advanced materials processing as providers of precision lapping and polishing, CNC machining, dicing, backgrinding, ultrasonic hole drilling and other precision machining services. With 30,000 square feet of manufacturing facilities, we operate over 100 single and double side lapping and polishing machines, up to 64" to handle parts from as small as .127mm square to as large as 1.83 meters (6') in dimension. We also offer production dicing services. With 15 dicing saws, we have one of the highest volume capacities in the industry. Our 4 axis CNC micromachining capabilities enable us to fabricate complex shapes and machine features such as pockets, cavities, slots, channels, chamfers, thru-holes, radii and steps, all with tight tolerances. Special capabilities include ultra-thin (as thin as 10 microns), ultra-flat (1/10 wave), superpolishing (1 Angstrom), tight tolerances (+/- 0.25 micron), parallelism and TTV to 0.1 micron. Optical and Semiconductor materials processed include Fused Silica, Quartz, Gorilla Glass, Borosilicate Glass, Soda Lime Glass, Sapphire, 96% and 99.6% Alumina, Aluminum Nitride, Silicon Carbide, Macor, Germanium, Silicon, Stainless Steel, Aluminum, Copper, Tungsten and more, many of which are in stock from our extensive inventory. Standard and custom products include substrates, windows, wafers, discs, lenses, color glass filters, prisms, wedges and other flat optics of various materials, 300 - 450mm ceramics, precision shims, spacers and submounts, witness samples, SEMI standard dummy wafers up to 450mm diamter, wafer and vacuum chucks, large metal mirrors, lapping and polishing of valve and seal components. We have collaborated on projects for multiple industries, including semiconductor, medical, aerospace, defense, telecommunications, optoelectronics, and photonics. Our offerings have also been an important resource for research projects conducted around the world. Today, we offer a unique value to customers, having the ability to process all types of materials to the most exacting specifications. We have established a reputation worldwide for excellence in quality, service, and R&D, as well as our state-of-the-art lapping, polishing, and dicing capabilities.
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